全多维编码的光学物理非克隆功能,用于集成电路防伪
Kun Wang1, Jianwei Shi2,3, Wenxuan Lai1
1State Key Laboratory of Silicon and Advanced Semiconductor Materials & School of Materials Science and Engineering, Zhejiang University, Hangzhou, Zhejiang, 310027, China.
Nature communications
|April 13, 2024
概括
研究人员为物联网 (IoT) 安全性开发了全新的全光学物理不可克隆功能 (PUF). 这些CMOS兼容的PUF提供了超高的信息,增强了设备识别和对伪造的身份验证.
科学领域:
- 材料科学 材料科学 材料科学
- 光电学是指光电子产品.
- 网络安全 网络安全
背景情况:
- 光学物理不可克隆功能 (PUF) 对物联网 (IoT) 设备安全至关重要.
- 现有的光学PUF面临着CMOS兼容性和有限的信息的挑战.
研究的目的:
- 开发CMOS兼容的光学PUF,增强信息,用于集成电路防伪.
- 为了解决目前光学PUF技术的局限性.
主要方法:
- 制造全多维编码的光学PUF,使用超表面和化量子点.
- 与补充性金属氧化物半导体 (CMOS) 兼容程序集成.
- 现场光学反应和信息的表征.
主要成果:
- 在单个像素内展示了五个现场光学响应,实现了2.32位/像素的超高信息.
- 归因于对辐射场和珀塞尔效应的位置依赖的光学反应.
- 使用比特统一性,哈明距离和错误的接受/拒绝率等指标评估PUF性能.
结论:
- 开发的全Si光学PUF是CMOS兼容的,为物联网安全提供了卓越的信息.
- 这些PUF能够为安全的物联网应用程序提供高效的轻量级相互认证协议.
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