基于芯片上的宽带,紧型TM模式的Mach-Zehnder光学隔离器基于InP-on-Insulator平台
Wan-Ting Chen1,2, Li Liu1, Jia Zhao1,2
1School of Information Science and Engineering, Shandong University, Qingdao 266237, China.
Nanomaterials (Basel, Switzerland)
|April 26, 2024
概括
我们开发了一种用于光子集成电路的新型InP-on-insulator光学隔离器. 这款紧型设备提供宽带性能,克服了与主动设备的集成挑战.
科学领域:
- 光子学和材料科学 材料科学
- 集成光学 集成光学 集成光学
- 半导体设备 半导体设备
背景情况:
- 集成光学隔离器对于光子集成电路 (PIC) 是必不可少的.
- 目前基于在绝缘体 (SOI) 的绝缘体面临与活性组件的集成限制.
- 需要先进的平台来提高隔离器的功能和兼容性.
研究的目的:
- 提出和设计一种新的宽带,紧的TM模式马赫-泽恩德光学隔离器.
- 探索InP-on-insulator平台,以实现增强的设备集成.
- 研究磁光波导结构的不同粘合技术.
主要方法:
- 使用InP-on-insulator设计了两个磁光波导结构.
- 采用O2等离子体表面激活直接晶圆粘合和DVS-基 (BCB) 粘合,用于Ce:YIG和InP集成.
- 进行了详细的计算和优化,以最大限度地实现非互惠相位移 (NRPS).
主要成果:
- 在1550nm的72nm的30dB带宽实现了直接结合的波导结构.
- 证明了0.256微米的设备长度差异.
- 分析了波导臂长度,制造精度和维度错误对性能的影响.
结论:
- 拟议的InP-on-insulator马赫-泽恩德光学隔离器为宽带,紧的PIC提供了一个可行的解决方案.
- 直接晶圆粘合和BCB粘合剂粘合在设备制造中具有明显的优势.
- 计算的制造公差为设备实现提供了实际指导.
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