在化学机械平面化中,随着时间的推移磨损效应的Pad度的新概率密度函数
Seonho Jeong1, Yeongil Shin1, Jongmin Jeong1
1Graduated School of Mechanical Engineering, Pusan National University, Busan 46703, Republic of Korea.
Materials (Basel, Switzerland)
|April 27, 2024
概括
这项研究引入了化学机械平面化 (CMP) 的新数学模型,该模型可以解释酸度的变化. 该模型通过考虑半导体制造过程中的磨损和度分布来准确预测材料去除率.
科学领域:
- 材料科学 材料科学 材料科学
- 机械工程 机械工程
- 半导体制造业 半导体制造业
背景情况:
- 化学机械平面化 (CMP) 对半导体制造至关重要,但其潜在机制需要进一步研究.
- 了解Pad-Wafer接口,特别是Pad度特征,对于解决CMP问题至关重要.
- 不均的硬度分布显著影响材料去除率 (MRR) 的预测.
研究的目的:
- 为CMP开发和验证一个修改后的数学模型.
- 将时间依赖的磨和分布变化纳入模型.
- 提高CMP过程中材料去除率的预测准确度.
主要方法:
- 使用了修改后的格林伍德-威廉姆森 (GW) 理论和概率密度函数 (PDF).
- 开发了一种新的接触模型,包括度高度和半径磨损的功能.
- 通过将模型预测与获得的实验值进行比较来进行实验验证.
主要成果:
- 与现有模型相比,开发的接触和MRR模型与实验结果更好地一致.
- 该研究证实,结合度磨损和分布变化可以提高MRR预测的准确性.
- 拟议的模型成功地根据不断变化的度分布预测了材料去除率.
结论:
- 修改后的数学模型为理解和预测CMP性能提供了更准确的方法.
- 通过考虑CMP期间硬度的动态变化,可以准确预测MRR.
- 这项研究通过提供精细的预测工具,有助于解决CMP的问题.
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