4H-SiC MOSFET 门电压不稳定性通过脉冲高温反向偏差和负门偏差应力评估
Laura Anoldo1, Edoardo Zanetti1, Walter Coco1
1STMicroelectronics, Stradale Primosole, 50, 95125 Catania, Italy.
Materials (Basel, Switzerland)
|April 27, 2024
概括
在650V的SiC MOSFET中,高温门偏差 (HTGB) 应力比高温反向偏差 (HTRB) 应力更为严重. 这是由于在HTGB下加速门绝缘体退化,影响电气参数.
科学领域:
- 材料科学 材料科学 材料科学
- 半导体物理 半导体物理
- 可靠性工程可靠性工程
背景情况:
- 碳化 (SiC) MOSFET对于高功率应用至关重要.
- 在压力下了解设备可靠性对于性能和寿命至关重要.
- 门绝缘体的完整性是SiC MOSFET可靠性的关键因素.
研究的目的:
- 在脉冲高温逆偏差 (HTRB) 和负高温门偏差 (HTGB) 应力下调查650VSiC平面MOSFET的可靠性.
- 分析电气参数的漂移并量化被困电荷.
- 在SiC MOSFET上比较HTGB与HTRB压力的严重程度.
主要方法:
- 实验压力测试使用脉冲HTRB和负HTGB.
- 技术 计算机辅助设计 (TCAD) 静态模拟用于电场分布分析.
- 监测电气参数的不稳定性和漂移分析.
- 使用Fowler-Nordheim (FN) 门注入电流开始转移来量化被困电荷.
主要成果:
- HTGB压力导致值电压 (ΔVth) 和FN电流开始 (ΔVFN) 的变化为15%.
- 在HTRB压力中, ΔVth和 ΔVFN的变化仅为4%.
- TCAD模拟和实验数据证实HTGB是更严重的压力状况.
结论:
- 高温门偏差 (HTGB) 应力对650 V SiC平面MOSFET比高温反向偏差 (HTRB) 应力更具破坏性.
- 在HTGB下,在源区域附近的门绝缘体的加速降解解释了观察到的参数转移.
- 福勒-诺德海姆电流发生转移是量化被困电荷和确定应力条件的可靠方法.
相关概念视频
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