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接口类型对3D打印异质合金材料动态变形行为的影响

Anmi Li^1,2,3, Yumeng Luo^1,2,3, Boya Wang^1,2,3

¹State Key Laboratory of Nonferrous Metals and Processes, China GRINM Group Co., Ltd., Beijing 100088, China.

Materials (Basel, Switzerland)

|April 27, 2024

概括

与非结合材料相比,TA1/TA15异构材料中的金结合能提高12%的能量吸收. 这种改进是由于界面上的协调变形,增加了承载时间和总体能量消耗.

科学领域:

材料科学材料科学材料科学
机械工程机械工程
金工业是金工业的一个方面.

背景情况:

像TA1和TA15这样的合金在航空航天和国防方面至关重要.
了解异构材料的动态机械行为对于结构完整性至关重要.
研究界面粘合在极端条件下的材料性能上的作用是必不可少的.

研究的目的:

为了比较TA1/TA15异构材料具有和没有金结合 (MB) 的动态压力负荷反应.
分析塑料变形机制,断裂形式和能量吸收性质的差异.
为了阐明微观结构机制,负责提高MB材料的性能.

主要方法:

使用Split Hopkinson压力棒 (SHPB) 技术进行压力有限的动态压力负荷实验.
对具有金结合接口 (MB) 和没有 (NMB) 的材料进行比较分析.
微观结构观察以确定变形和断裂特征.

主要成果:

在MB和NMB材料之间没有观察到塑性变形机制的显著差异.
所有样本都在TA1组件中表现出"V形"骨折.
NMB材料在57μs时失败,吸收441 J/cm3;MB材料在72μs时失败,吸收495 J/cm3.
在接口附近,MB材料表现出协调变形,TA1和TA15都承载着应力.

结论:

金结合使TA1/TA15异构结构的承载时间和能量吸收率提高了12%.
在MB接口上的协调变形是改善能量吸收的关键机制.
这些发现为设计具有卓越动态性能的先进基材料提供了宝贵的见解.

关键词:

变形机制的变形机制是什么动态骨折动态骨折是一种动态骨折.高张变率的高张变率.剪切带的剪切带.

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