全有机聚胺基复合膜的高能量密度,通过对基于聚乙烯化物的Relaxor铁电器进行兴奋剂
Chengwei Wang1, Yue Shen2, Xiaodan Cao2
1Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, Beijing 100083, China.
Polymers
|April 27, 2024
概括
由P ((VDF-TrFE-CFE) 聚合物和PI制成的全有机介电复合膜显示了高能量密度电容器的性能改善. 这些terp/PI薄膜提供更高的能量密度和充放电效率,使它们适合实际应用.
科学领域:
- 材料科学 材料科学 材料科学
- 聚合物科学 聚合物科学
- 电气工程 电气工程
背景情况:
- 全有机介电复合材料在电容器应用中越来越受欢迎,因为它们的兼容性优越,接口缺陷较少.
- 聚胺 (PI) 是一种常见的基质,但其介电性质可以增强.
- 高能量密度电容需要具有高电容性和分解强度的材料.
研究的目的:
- 开发和表征全有机P ((VDF-TrFE-CFE) 聚合物/PI复合膜.
- 评估这些复合材料的介电性质,能量密度和电荷-放电效率.
- 了解复合膜中提高性能的基本机制.
主要方法:
- 制造各种有机P ((VDF-TrFE-CFE) 聚合物/PI复合膜,含有不同的聚合物.
- 在1kHz时测量介电电容.
- 评估能量密度和电荷-放电效率.
- 热刺激放电电流 (TSDC) 分析和频段结构分析.
- 在高温暴露和循环下进行耐用性测试.
主要成果:
- /PI-5复合膜 (5%的聚合物) 的导电率为3.81,比原始PI增加了18.7%.
- 特尔普/PI-5膜实现了最高的能量密度 (9.67 J/cm3) 和84.7%的充放电效率.
- 与原始PI相比,能量密度提高了59.8%.
- TSDC和带结构分析表明复合材料中存在更深的陷,抑制了泄漏电流.
- 复合膜在长时间的高温暴露和循环中表现出稳定性.
结论:
- 全有机/PI复合膜为高能量密度电容应用提供了增强的介电特性.
- 加入P ((VDF-TrFE-CFE) 聚合物显著提高了能量密度和电荷-放电效率.
- 存在更深的陷有助于提高电气性能和抑制泄漏电流.
- 证明的稳定性证实了这些复合膜在实际使用中的可行性.
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