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在多场合下研究先进包装的可靠性:综述
Yongkun Wang1, Haozheng Liu1, Linghua Huo1
1State Key Laboratory of Electromechanical Integrated Manufacturing of High-Performance Electronic Equipments, Xidian University, Xi'an 710071, China.
Micromachines
|April 27, 2024
概括
由于复杂的物理场,先进的包装技术,如Flip Chip (FC) 和3D包装面临可靠性问题. 多领域合研究对于确保这些关键电子元件的长期性能至关重要.
科学领域:
- 材料科学 材料科学 材料科学
- 电气工程 电气工程
- 机械工程 机械工程
背景情况:
- 摩尔定律的局限性推动了对先进包装解决方案的需求,如翻转芯片 (FC),晶圆级包装 (WLP),包装中的系统 (SiP) 和3D包装.
- 这些技术提供了高性能,小型化和成本降低,但引入了诸如更小的热空间和更高功率密度等挑战.
- 增加功率密度会加剧复杂的物理场 (电,热,应力),影响互连可靠性.
研究的目的:
- 审查先进包装技术的发展和特征.
- 讨论在合热,电和电磁场下的先进包装互连中的可靠性问题.
- 探索当前的研究方法和未来的前景,多领域合可靠性在先进的包装.
主要方法:
- 关于先进包装技术及其演变的文献综述.
- 在封闭的包装空间中分析热,电和电磁场所带来的可靠性挑战.
- 综合现有关于包装互连的多领域合效应的研究.
主要成果:
- 先进的包装互连由于热,电和应力场的相互作用而容易发生故障.
- 高级包装中较小的物理尺寸和更高的功率密度加剧了这些可靠性问题.
- 目前的研究重点是了解和减轻这些多领域合效应.
结论:
- 多领域的合研究对于解决先进包装互连的可靠性至关重要.
- 解决这些复杂的物理相互作用是确保下一代电子设备的性能和寿命的关键.
- 未来的研究应该专注于先进包装中的多场合现象的预测建模和实验验证.
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