一项关于在温度循环和极限压力条件下对3D包装存储模块可靠性评估的研究
Shuai Zhou1,2, Kaixue Ma1, Yugong Wu1
1School of Microelectronics, Tianjin University, Tianjin 300072, China.
Micromachines
|April 27, 2024
概括
由于快速温度变化的热疲劳,3D包装存储模块可能会发生故障. 由于CTE差异而加剧的塑料和爬行菌株的裂是关键的故障因素,经过10%准确度的模拟证实.
科学领域:
- 材料科学 材料科学 材料科学
- 机械工程 机械工程
- 可靠性工程可靠性工程
背景情况:
- 可靠性提升测试技术对于先进的电子包装至关重要.
- 了解3D包装存储模块的应力-应变特性对于设备的寿命至关重要.
研究的目的:
- 分析3D包装存储模块的应力-应变特性.
- 在温度循环测试期间评估操作和破坏极限.
- 识别影响可靠性的弱点和故障机制.
主要方法:
- 利用各种测试组合和有限元模拟.
- 进行了温度循环测试,温度范围从-65°C到+150°C.
- 分析了压力-应变行为和故障模式.
主要成果:
- 3D包装存储设备在温度突然变化下容易发生热疲劳故障.
- 塑料和爬行菌株的积累导致裂形成,这是一个主要的故障机制.
- 环氧树脂和接接头之间的热膨胀系数 (CTE) 差异加速了裂的形成.
结论:
- 有限元模拟与实验测试结果非常相匹配,偏差在10%以内.
- 热疲劳是循环温度压力下的3D包装存储模块的重要故障模式.
- 识别和减轻CTE不匹配效应对于提高3D包装可靠性至关重要.
相关概念视频
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