提高p-GaN门高电子移动性晶体管与GaN/AlN/AlGaN屏障结构的性能
An-Chen Liu1, Yu-Wen Huang1, Hsin-Chu Chen2
1Department of Photonics and Institute of Electro-Optical Engineering, College of Electrical and Computer Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan.
Micromachines
|April 27, 2024
概括
这项研究引入了高电子流动性晶体管 (HEMT) 的新型复合材料屏障结构,显著增加了37%的排水电流,并减少了23%的电阻. 性能提升源于提高载体密度和减少泄漏通路.
科学领域:
- 半导体设备 半导体设备
- 材料科学 材料科学 材料科学
- 电子工程 电子工程
背景情况:
- 高电子移动性晶体管 (HEMT) 对于高频应用至关重要.
- 传统的HEMT结构面临着门泄漏和阻力方面的挑战.
- 优化屏障结构是提高HEMT性能的关键.
研究的目的:
- 展示一种新的复合屏障结构,用于增强模式的HEMTs.
- 为了提高最大的排水电流和减少电阻 (Ron).
- 为了减少p-GaN/GaN/AlN/AlGaN/GaN HEMTs中的门泄漏.
主要方法:
- 有或没有复合材料屏障的HEMT的制造和表征.
- 使用未使用的GaN (u-GaN) 层来缓解Mg扩散.
- 使用Synopsys Sentaurus TCAD进行设备模拟和分析.
主要成果:
- 在复合屏障下,最大排水电流增加了37%.
- 实现了对抗性 (Ron) 的23%降低.
- 该AlN屏障层增强了2DEG载体密度,并阻断了泄漏通道.
结论:
- 复合材料屏障结构显著提高了HEMT的性能.
- u-GaN层有效地抑制了Mg扩散,提高了设备的稳定性.
- AlN层的高能量差距对于优越的电气性能和减少泄漏至关重要.
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