一种用于自动预测单元集成电路的辐射诱导脆弱性的方法
Rui Dong1, Hongliang Lu1, Caozhen Yang1
1Key Laboratory for Wide Band Gap Semiconductor Materials and Devices of Education Ministry, School of Microelectronics, Xidian University, Xi'an 710071, China.
Micromachines
|April 27, 2024
概括
集成电路由于尺寸缩小,容易受到粒子辐射的影响. 这项研究引入了一种新方法,可以准确预测由负载共享效应引起的软误差,从而提高电路可靠性.
科学领域:
- 半导体技术的半导体技术
- 集成电路可靠性 集成电路可靠性
- 电子产品中的辐射效应.
背景情况:
- 现代半导体技术面临着由于工作电压和值电压降低而对粒子辐射的敏感性增加.
- 缩小过程的大小加剧了负载共享效应,使单一事件效应成为集成电路故障的主要原因.
- 有效的灵敏度评估方法对于优化集成电路设计和提高辐射可靠性至关重要.
研究的目的:
- 开发一种准确的方法来评估集成电路对粒子辐射的灵敏度.
- 为应对先进半导体设备中电荷共享效应引起的软误差日益增长的挑战.
- 改进集成电路中单一事件效应的预测和减轻.
主要方法:
- 建立了电荷共享效应的设备模型,并进行了模拟.
- 开发了一个神经网络模型来预测初级和二级设备中的电荷量.
- 提出并验证了一种全面的自动化方法,用于使用TCAD模拟计算单元电路中的软误差.
主要成果:
- 拟议的软误差计算自动化方法在与TCAD模拟进行验证时,实现了2.8-4.3%的误差率.
- 该研究成功地模拟了电荷共享效应,并使用神经网络预测了电荷量.
- 证明了开发的软误差计算方法的准确性和有效性.
结论:
- 开发的自动化方法为计算集成电路中的软误差提供了准确和有效的方法.
- 这些发现有助于优化集成电路设计和改进单一事件效应的实验方法.
- 这项研究提高了对半导体设备中辐射引起的故障的理解和缓解.
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