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安全的 ECDSA SRAM-PUF 基于通用单/双标尺乘法架构

Jingqi Zhang¹, Zhiming Chen¹, Xiang He¹

¹School of Integrated Circuits and Electronics, Beijing Institute of Technology, Beijing 100081, China.

|April 27, 2024

概括

这项研究通过使用圆曲线加密的新型软决策SRAM-PUF来增强网络安全. 该设计为设备身份验证提供了更好的安全性和性能.

科学领域:

网络安全和加密技术
硬件安全和嵌入式系统

背景情况:

物理非克隆功能 (PUF) 提供了对网络安全至关重要的独特设备标识符.
由于其简单的实现,SRAM-PUF被广泛使用,通常采用软决策的Reed-Muller (RM) 代码.
现有的RM代码设计面临来自软决策攻击算法的潜在安全风险.

研究的目的:

引入一个软决策的Reed-Muller (RM) 代码攻击算法,以暴露安全漏洞.
提出一种由圆曲线数字签名算法 (ECDSA) 保护的新型软决策SRAM-PUF结构.
为了提高安全SRAM-PUF的处理速度和硬件效率.

主要方法:

开发了一个定制的 ECDSA 方案,以提高处理速度.
建议使用差分加链 (DAC) 进行圆曲线标尺乘法 (ECSM) 和圆曲线双标尺乘法 (ECDSM) 的通用架构.
在FPGA (Xilinx Virtex-7) 和ASIC (TSMC 40 nm) 上实现了设计.

主要成果:

与现有方法相比,实现了明显较低的位误差率 (2.7×10-10).
通过3902个切片和6.615微秒的ECDSM延迟证明了优越的区域时间性能.
对于ECSM/ECDSM操作的通用架构有效地节省了硬件资源.

结论:

拟议的软决策SRAM-PUF与自定义ECDSA提供了针对RM代码攻击的增强安全性.
基于差异加法链的通用架构提供了高效和节省资源的硬件实现.
这项研究为安全和高性能硬件安全解决方案带来了有前途的进展.

关键词:

这就是SRAM-PUF.圆曲线数字签名算法数字签名算法圆曲线的双倍标量乘法乘法.圆曲线标尺乘法圆曲线标尺乘法

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