在2O3中超薄的亚-5nm晶体管用于高性能和低功耗电子应用
Linqiang Xu1,2, Lianqiang Xu3, Jun Lan4
1State Key Laboratory of Mesoscopic Physics and Department of Physics, Peking University, Beijing 100871, China.
ACS applied materials & interfaces
|April 27, 2024
概括
超薄的氧化 (In2O3) 场效应晶体管 (FET) 显示出高性能和低功耗电子产品的潜力. 模拟表明这些FET可以缩放到2nm,超过其他2D半导体.
科学领域:
- 材料科学 材料科学 材料科学
- 凝聚物质物理学 凝聚物质物理学
- 纳米电子学纳米电子学
背景情况:
- 超薄氧化物半导体对于后端线 (BEOL) 兼容晶体管和3D集成至关重要.
- 氧化 (In2O3) 超薄场效应晶体管 (FET) 的性能非常出色,其厚度低至0.4nm,可实现高排水电流和超导电.
研究的目的:
- 通过使用ab initio量子传输模拟,研究5nm以下门长 (Lg) 的超薄In2O3FET的性能极限.
- 根据半导体国际技术路线图 (ITRS) 标准,评估超薄In2O3对高性能 (HP) 和低功耗 (LP) 电子产品的潜力.
主要方法:
- 最初的量子运输模拟被用来分析超薄的In2O3FETs.
- 性能指标包括现状电流,延迟时间和功耗被根据ITRS标准评估.
主要成果:
- 超薄的In2O3FET可以达到HP设备的2nm的缩放极限,满足ITRS对当前状态,延迟时间和功耗消耗的标准.
- 超薄In2O3的宽带间隙 (3.0 eV) 允许LP电子与Lg降至3nm.
- 与MoS2和MoTe2.2相比,HP和LP超薄In2O3FET均表现出优异的能量延迟产物.
结论:
- 超薄的In2O3FET显示为先进的纳米电子应用具有显著的前景.
- 这些设备为未来的高性能和低功耗集成电路提供了引人注目的替代方案.
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