软和减压的热接口材料与蜂板模拟填充网络用于电子散热
Wenjie Liu1, Yijie Liu1, Shujing Zhong1
1Department of Polymer Science and Engineering, Shanghai Key Laboratory of Electrical Insulation and Thermal Ageing, Shanghai Jiao Tong University, Shanghai, 200240, China.
Small (Weinheim an der Bergstrasse, Germany)
|April 28, 2024
概括
新的软热接口材料 (TIM) 开发了具有高导热性和阻尼能力的新材料. 这些材料有效地散热热量,并减少高功率电子产品在振动下的温度波动.
科学领域:
- 材料科学 材料科学 材料科学
- 纳米技术 纳米技术
- 机械工程 机械工程
背景情况:
- 高功率的电子设备产生大量的热量,需要高效的热管理解决方案.
- 电子设备中的振动需要柔软和缓冲的热接口材料 (TIM) 来实现可靠的散热.
- 在TIM中同时实现低硬度,高和优越的导热率是一个重大挑战.
研究的目的:
- 设计和准备新的柔软,阻尼和导热的TIM.
- 为了研究开发的TIM的热,机械和减压性能.
- 评估这些TIM在实际应用中的性能,例如5G基站和汽车部件.
主要方法:
- 在动态聚胺矩阵内使用蜂板模仿化纳米板 (BNNS) 网络通过水平离心造制造TIM.
- 通过平面导热率,压力强度和阻尼性能 (损失触角) 的表征.
- 在振动条件下评估高功率电子设备的散热效率和温度波动降低.
主要成果:
- 开发的TIM表现出高透平面导热率 (>7.69 W m-1 K-1),以及均的热传递.
- 这些材料表现出低压力强度 (2.16 MPa 在20%的应变下) 和优异的阻尼 (tan δ > ≈0.3 在广泛的频率范围内).
- 与商业材料相比,TIMs在测试应用中提供了优越的散热 (改善4.1°C) 和降低的温度波动 (1.8°C).
结论:
- 一种创新的方法来创建柔软,和导热的TIM已经成功地证明了这一点.
- 独特的BNNS网络和动态聚胺矩阵可以同时优化热,机械和阻尼性能.
- 这些先进的TIM提供了一个可行的解决方案,用于高功率密度的电子设备中有效的热管理,这些电子设备受到振动的影响.
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