在--氧化 (IGZO) 薄膜晶体管 (TFT) 中浮体效应
Jingyu Park1, Seungwon Go2, Woojun Chae3
1School of Electrical Engineering, Kookmin University, Seoul, 02707, Republic of Korea.
Scientific reports
|May 2, 2024
概括
在---氧化物 (IGZO) 薄膜晶体管 (TFT) 中的浮体效应 (FBE) 导致设备故障. 这项研究揭示了FBE通过在AC压力下由于捐赠者产生导电路径而导致短暂失败.
科学领域:
- 材料科学 材料科学 材料科学
- 电气工程 电气工程
- 半导体物理 半导体物理
背景情况:
- ---氧化物 (IGZO) 薄膜晶体管 (TFT) 对于现代电子产品至关重要.
- 浮体效应 (FBE) 是一些半导体设备中已知的现象.
- 了解设备故障机制对于可靠性至关重要.
研究的目的:
- 在IGZO TFT中首次报告浮体效应 (FBE).
- 为了阐明IGZO TFT中FBE诱导的设备故障的机制.
- 分析FBE对IGZO TFT电气特性的影响.
主要方法:
- 切换交流脉冲到门和排水管的应用.
- 分析排水电流的行为和开启/关闭开关特性.
- 在不同的电压条件下,研究源和排水区域的供体生成.
主要成果:
- 在IGZO TFT中的FBE导致排水电流大幅增加,防止开启/关闭.
- 设备故障,称为"短故障",是由源和排水之间形成导电路径引起的.
- 捐赠体的产生,归因于高侧电场下的电子诱导的过氧化物形成,降低了值电压.
结论:
- 该研究严格分析了IGZO TFT中的FBE及其在短暂失败中的作用.
- 由交流压力驱动的排水和源区域的捐赠体的产生最终导致了短暂的故障.
- 这项研究为IGZO TFT可靠性和故障机制提供了新的见解.
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