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相关实验视频

Updated: Jun 26, 2025

Fabrication and Testing of Photonic Thermometers

Fabrication and Testing of Photonic Thermometers

Published on: October 24, 2018

机械灵活的晶圆尺度集成光学制造平台

Milica Notaros¹, Thomas Dyer², Andres Garcia Coleto¹

¹Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA.

Scientific reports

|May 9, 2024

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研究人员开发了第一个晶圆尺度制造工艺,用于机械灵活的集成光子学. 这一突破使可穿戴设备和灵活电子产品的新应用成为可能,因为它克服了基于的刚性平台的局限性.

科学领域:

综合光子学综合光子学
材料科学是一种材料科学.
晶圆尺度制造工艺晶圆尺度制造工艺

背景情况:

综合光子学已经使用晶圆尺度制造进行了进步,用于红外和可见波长.
目前在基板上的平台导致刚性光子晶圆和芯片,限制了应用.
现有的灵活光子制造仅限于芯片规模,阻碍了可扩展性.

研究的目的:

开发和描述第一个300mm晶圆尺度平台,用于机械灵活的集成光学.
为了实现需要柔性光子设备的新应用,例如可穿戴医疗监视器和显示器.

主要方法:

开发了一个300mm晶圆尺度的CMOS兼容的灵活平台和制造工艺.
在可见波长上实验证明了光学功能 (芯片合,波导路由,被动设备).
进行了曲耐用性测试,并描述了曲下的偏振旋转效应.

主要成果:

成功创建了第一个晶圆尺度灵活的集成光子平台.
在灵活的光子芯片上展示了关键的光学功能.
光子芯片承受了2000个曲,直径为0.5英寸,光学性能没有降低.

结论:

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Last Updated: Jun 26, 2025

Fabrication and Testing of Photonic Thermometers

Fabrication and Testing of Photonic Thermometers

Published on: October 24, 2018

Fabrication of Flexible Image Sensor Based on Lateral NIPIN Phototransistors

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Published on: June 23, 2018

Characterization of SiN Integrated Optical Phased Arrays on a Wafer-Scale Test Station

Characterization of SiN Integrated Optical Phased Arrays on a Wafer-Scale Test Station

Published on: April 1, 2020

开发的平台和工艺允许晶圆规模生产机械灵活的光子芯片.
这一进步使集成光子学开辟了新的应用领域,需要灵活性和耐用性.
该研究克服了灵活光子制造中的可扩展性限制.