相关实验视频

Updated: Jun 26, 2025

Demonstrating the Simplicity and In Situ Temperature Monitoring of the Mechanochemical Synthesis of Metal Chalcogenides Suitable for Thermoelectrics
04:09

Demonstrating the Simplicity and In Situ Temperature Monitoring of the Mechanochemical Synthesis of Metal Chalcogenides Suitable for Thermoelectrics

Published on: August 30, 2024

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关于对SnAgCu和SnZn接接头的杂质影响的比较研究,带有电子沉积的Cu

Yu-Ju Li1, Yee-Wen Yen2,3, Chih-Ming Chen1

  • 1Department of Chemical Engineering, National Chung Hsing University, 145 Xingda Rd., South Dist., Taichung 402202, Taiwan.

Materials (Basel, Switzerland)
|May 11, 2024
PubMed
概括

铜电层中的杂质严重损坏了Sn-3Ag-0.5Cu (SAC305) 接接头,导致空隙和更快的金属间化合物生长. 基于Sn-9Zn的合剂对这些杂质的影响最小.

关键词:
基肯戴尔效应是什么意思扩散扩散是一种扩散.电 Cu Cu 是一个电 Cu.污染物是一种杂质.接器 接器 接器 接器

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