通过调节界面结相互作用来设计具有高粘附能量和低界面热电阻的软/硬接口

Xiangliang Zeng1, Ting Liang2,3, Xiaxia Cheng2

  • 1College of Chemistry and Chemical Engineering, Hunan University, Lushan South Road, Yuelu District, Changsha 410082, People's Republic of China.

Nano letters
|May 14, 2024
PubMed
概括

研究人员开发了一种新的聚氨/接口,具有强大的附着性和高效的传热. 这一突破是通过控制键来实现的,为软/硬材料应用提供了一个有前途的解决方案.

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