通过调节界面结相互作用来设计具有高粘附能量和低界面热电阻的软/硬接口
Xiangliang Zeng1, Ting Liang2,3, Xiaxia Cheng2
1College of Chemistry and Chemical Engineering, Hunan University, Lushan South Road, Yuelu District, Changsha 410082, People's Republic of China.
Nano letters
|May 14, 2024
概括
研究人员开发了一种新的聚氨/接口,具有强大的附着性和高效的传热. 这一突破是通过控制键来实现的,为软/硬材料应用提供了一个有前途的解决方案.
科学领域:
- 材料科学 材料科学 材料科学
- 聚合物化学 聚合物化学
- 接口工程 接口工程
背景情况:
- 同时在软/硬接口上实现高粘附性和高效的热传递是具有挑战性的.
- 这些特性对于电子包装,软电子和电池的应用至关重要.
- 现有的方法难以平衡相互矛盾的界面要求.
研究的目的:
- 开发一个软/硬接口,同时增强粘附能量和降低接口热阻.
- 为了研究键在调整接口属性的作用.
- 为材料系统中接口属性控制提供一种新的策略.
主要方法:
- 制造一个聚氨/接口.
- 引入以大豆油为基础的环氧交叉连接器来修改结.
- 粘附能量和界面热阻的表征.
主要成果:
- 实现了13535 J m-2.2的高粘附能量.
- 获得了0.89 × 10−6 m2 K W−1.1. 的低热接口电阻.
- 证明交叉连接器在接口上调节键,增强粘附和热传递.
结论:
- 开发的聚氨/接口成功克服了粘附和热传递之间的权衡.
- 通过生物基交叉连接器调节相互作用是接口工程的有效策略.
- 这项工作为设计具有定制界面特性的先进材料提供了有前途的方法.
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