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Jianfeng Fan1,2, Yu Zhou1, Shengchang Ding1

  • 1State Key Laboratory of Materials for Integrated Circuits, Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, 518055, China.

概括

这项研究通过控制界面属性,开发了用于电子产品的坚固,弹性和导热性弹性体复合材料. 这种新的方法可以提高压力下设备的散热率.