微结构在接接头的热疲劳中的作用
J W Xian1,2, Y L Xu3,4, S Stoyanov5
1Department of Materials, Imperial College London, London, UK. jwxian@dlut.edu.cn.
Nature communications
|May 20, 2024
概括
了解接关节的微观结构是防止电子产品中热疲劳故障的关键. 这项研究量化了锡-银-铜关节的微观结构变化和损伤,揭示了影响疲劳抵抗的因素.
科学领域:
- 材料科学 材料科学 材料科学
- 机械工程 机械工程
- 可靠性工程可靠性工程
背景情况:
- 热疲劳是电子接接头的关键故障机制.
- 微结构对接关节热疲劳的影响仍然不完全理解.
研究的目的:
- 在热疲劳下量化Sn-3Ag-0.5Cu接关节的微观结构演变和损伤.
- 为了在球网格阵列 (BGA) 包中建立微观结构,关节位置和热疲劳阻力之间的联系.
主要方法:
- 电子反射散射衍射 (EBSD) 地图绘制以分析子粒,再结晶和Ag3Sn粗化.
- 多尺度建模,整合连续性和晶体可塑性有限元素模型.
- 损伤演变的测量依赖于β-Sn晶体方向和CTE不匹配.
主要成果:
- 微观结构变化的详细量化,包括亚粒形成和Ag3Sn粗化.
- 损伤演变的证明依赖于β-Sn晶体方向和谷间CTE不匹配.
- 确定了接微结构与关节位置在确定疲劳寿命方面的相对意义.
结论:
- 该研究提供了对微结构演变及其对接关节热疲劳的影响的全面了解.
- 结果为设计具有增强热疲劳抵抗力的接关节微结构提供了基础.
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