在Ga-Doped HfO2铁电薄膜中具有低强制场的域切换特征
Yu-Chun Li1, Teng Huang1, Xiao-Xi Li1
1State Key Laboratory of ASIC and System, Shanghai Institute of Intelligent Electronics & Systems, School of Microelectronics, Fudan University, Shanghai 200433, China.
Nano letters
|May 24, 2024
概括
在氧化哈夫 (Ga-HfO) 薄膜中的兴奋剂使可调节的强制场能够用于先进的铁电记忆. 这项研究优化了Ga-HfO2用于高速,低压设备操作.
科学领域:
- 材料科学 材料科学 材料科学
- 固态物理 固态物理
- 纳米技术纳米技术
背景情况:
- 基于氧化 (HfO2) 的材料对于开发下一代铁电记忆器件至关重要.
- 在这些设备中实现高速和低压运行需要精确控制铁电特性,特别是强制场 (E).
- (Ga) 兴奋剂为调节HfO薄膜的铁电行为提供了一个潜在的策略.
研究的目的:
- 为了研究不同兴奋剂度对 hafnium氧化物薄膜的铁电特性的影响.
- 了解 Ga 兴奋剂,膜微观结构和极化切换机制之间的关系.
- 建立Ga-doping作为一种可行的方法来降低基于HfO的铁电记忆中的强制场.
主要方法:
- 使用原子层沉积 (ALD) 用受控的HfO2/Ga2O3循环比,制造配氧化 (Ga-HfO2) 薄膜.
- 铁电性质的表征,包括在不同的 Ga 注水平下测量强制场 (Ec).
- 分析极化切换动态,区分域核和传播机制.
主要成果:
- 在Ga-HfO2片中,可调节的强制场 (Ec) 从1.1 MV/cm到0.6 MV/cm不等,且Ga的兴奋剂增加.
- Ec的调制归因于域核和传播速度之间的相互作用,受Ga度的影响.
- 较高的Ga兴奋剂度将切换机制转移到较低电场的传播主导.
结论:
- 被证实是有效的剂,可显著降低HfO2基铁电材料中的强制场.
- 该研究提供了关键的洞察力,对控制偏振切换在杂铁电的领域动力学.
- 这项工作为设计具有增强性能特性的基于HfO2的先进铁电内存提供了一条途径.
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