在集成电路中对金属氧化物半导体的可靠性研究
Boris V Malozyomov1, Nikita V Martyushev2, Natalia Nikolaevna Bryukhanova3
1Department of Electrotechnical Complexes, Novosibirsk State Technical University, 20, Karla Marksa Ave., 630073 Novosibirsk, Russia.
Micromachines
|May 25, 2024
概括
这项研究调查了可靠性测试期间CMOS IC参数退化. 激活能量随着温度的增加而增加,而加速系数则减少,计算值与标准值不同.
科学领域:
- 电气工程 电气工程
- 材料科学 材料科学 材料科学
- 半导体物理 半导体物理
背景情况:
- 半导体设备和集成电路 (IC) 容易发生参数退化.
- 可靠性测试对于理解IC中的故障机制至关重要.
- 常见的故障包括静止电流变化和输出电压不稳定.
研究的目的:
- 在可靠性测试期间分析TPS54332 CMOS IC的参数退化.
- 在各种温度条件下确定激活能量和加速系数.
- 调查温度与这些可靠性参数之间的关系.
主要方法:
- 关于半导体设备可靠性和故障模式的文献综述.
- 在TPS54332 IC上进行实验性可靠性测试,重点关注静止电流和输出电压.
- 在不同温度状态下计算激活能量和加速度系数.
- 对故障安全测试结果和芯片样本表征的分析.
主要成果:
- 实验确定激活能量和加速度系数值.
- 观察到激活能量的线性增加随着温度的增加.
- 观察到加速度系数随着温度的增加而下降.
- 计算的激活能量发现低于标准值的0.1 eV.
结论:
- 该研究提供了关于TPS54332 IC可靠性的关键数据.
- 温度显著影响激活能量和加速系数.
- 与标准激活能量值的偏差凸显了需要精确的可靠性评估的需要.
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