,

Dawei Wang1, Wensheng Zhao1

  • 1School of Electronics and Information and School of Integrated Circuit Science and Engineering, Hangzhou Dianzi University, Hangzhou 310018, China.

Micromachines
|May 25, 2024
PubMed
概括

互连和包装技术对于高性能,小型化和低功耗电子设备至关重要. 这些领域的进步推动了消费电子和计算的未来.

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