在CO2电还原条件下,H和CO共诱导Cu表面的粗化

Zisheng Zhang1, Winston Gee1, Philippe Sautet1,2,3

  • 1Department of Chemistry and Biochemistry, University of California, Los Angeles, California 90094, United States.

概括

在电化学条件下对铜 (Cu) 的表面重组是减少二氧化碳的关键. 这项研究揭示了 Cu 表面与吸附 CO 和 H 的动态演变,确定了关键的中间结构及其形成机制.

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