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基于Bi₂Te₃的合金和Ni电极之间的原子分辨率界面反应机制

Zefan Xue¹, Weichao Lu^1,2, Wenjun Cui^1,2

¹NRC (Nanostructure Research Centre), Wuhan University of Technology, Wuhan 430070, China.

ACS applied materials & interfaces

|May 31, 2024

概括

在热电材料 (基于Bi2Te3) 和Ni电极之间的接口间的相互扩散驱动微观结构变化. 了解这些反应是防止热电装置退化和提高能量转换效率的关键.

科学领域:

材料科学材料科学材料科学
纳米技术纳米技术
固态化学固态化学

背景情况:

热电 (TE) 材料和电极之间的界面反应显著影响设备的性能和寿命.
(Ni) 是一种常见的电极材料,用于基于甲化物 (Bi2Te3) 的 TE 材料,但其界面行为是复杂的.

研究的目的:

研究基于Bi2Te3的TE材料 (n型BTS和p型BST) 与Ni电极之间的接口上的原子级微结构演变和扩散机制.
阐明不同元素 (Bi,Te,Se,Sb,Ni) 在界面反应中的作用及其对TE装置性能的影响.

主要方法:

扫描传输电子显微镜 (STEM) 在原子分辨率上进行球形偏差校正.
在现场加热STEM以观察动态接口反应.
通过将Ni纳米颗粒沉积在脱皮的BTS和BST材料上,然后进行化来制造接口.

主要成果:

最初的界面反应主要由Ni扩散到TE矩阵中,形成NiAs类型的NiM间金属.
在富含Sb的BST中观察到Ni跨五层扩散;在富含Bi的BST中观察到Ni-Te偏好反应和异常的谷物生长.
生物扩散到BTS形成Bi双层或Bi2[Bi2(Te,Se) 3);生物扩散到Ni膜加速了界面反应.
由于富含Bi的BTS反应而形成的倾斜和旋转接口.

结论:

这项研究为基于Bi2Te3的热电材料和Ni电极之间的复杂界面反应提供了原子层面的见解.
了解这些扩散机制和微观结构的演变对于减轻界面降解和提高热电设备的长期稳定性和效率至关重要.

关键词:

反应接口的反应接口反应接口.接口扩散的介面扩散.反应机制的反应机制.扫描传输电子显微镜扫描传输电子显微镜热电材料是一种热电材料.范德瓦尔斯的材料

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