在多层薄膜中确定热应力和取决于温度的材料特性的一种实际方法
Yanqiao Yang1, Andreas Winkler1, Atefeh Karimzadeh1
1Leibniz IFW Dresden, SAWLab Saxony, Institute for Emerging Electronic Technologies (IET), Group "Acoustic Microsystems", Helmholtzstr. 20, 01069 Dresden, Germany.
ACS applied materials & interfaces
|June 10, 2024
概括
本研究提出了一种新的分析模型,用于确定微电子机械系统 (MEMS) 中薄膜的温度依赖性质. 多层适应的Stoney方程使高温应用可靠的设计成为可能.
科学领域:
- 材料科学 材料科学 材料科学
- 机械工程 机械工程
- 纳米技术 纳米技术
背景情况:
- 多层薄膜是微电子机械系统 (MEMS) 中的关键组件.
- 精确的热力学特性表征对于在苛刻的环境中可靠的MEMS性能至关重要.
- 分析多层薄膜的现有方法往往复杂且在实验上有限.
研究的目的:
- 引入一种新的分析模型,以间接确定多层薄膜单个层的温度依赖的模和热诱导应力.
- 为分析复杂薄膜系统提供方便和高效的方法.
- 提高在高温下运行的MEMS设备的可预测性和可靠性.
主要方法:
- 基于样本曲率测量的多层适应的Stoney方程的导出.
- 获取单个实验数据以进行有效的分析.
- 使用五层RuAl金属化系统进行实验和数值验证.
主要成果:
- 新得出的分析模型准确地确定了温度依赖的模和单个薄膜层的热诱导应力.
- 该模型简化了复杂的多层系统的分析.
- 实验验证证证实了该模型在实际MEMS分析中的可用性.
结论:
- 多层适应的Stoney方程为MEMS中薄膜的表征提供了一个实用的解决方案.
- 这种模型克服了当前的实验限制,可以更好地了解多层薄膜的行为.
- 这些发现对于用于高温和恶劣环境的MEMS的设计和可靠性至关重要.
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