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通过-合金种子层在电Ni/Cu/Ag中增强粘合并减少欧姆接触
Zhao Wang1,2, Haixia Liu1, Daming Chen2
1School of Materials Science and Engineering, Jiangsu University, Zhenjiang 212013, China.
Materials (Basel, Switzerland)
|June 19, 2024
概括
研究人员开发了一种新的Ni/Si合金种子层,用于n型道氧化物消极接触式 (n-TOPCon) 太阳能电池. 这提高了粘附性,降低了接触阻力,提高了太阳能电池的性能,降低了成本.
科学领域:
- 材料科学 材料科学 材料科学
- 太阳能光伏发电是如何实现的
- 半导体设备物理 半导体设备物理
背景情况:
- 合Ni/Cu/Ag接触器是太阳能电池中使用银的成本高效替代品.
- 在n型道氧化物消极接触器 (n-TOPCon) 中的电接触器,太阳能电池面临着后侧电网线粘附和欧姆接触电阻的挑战.
研究的目的:
- 为了解决粘附问题并降低n-TOPCon太阳能电池中的欧姆接触电阻.
- 提出并验证使用Ni/Si合金种子层的新型金属化方法.
主要方法:
- 通过电子束蒸发在太阳能电池背面沉积一个层.
- 使用H2SO4:H2O2蚀刻剂去除多余的,并在化 (300-425°C) 过程中形成种子层.
- 描述Ni/Si合金层的粘附性,接触阻力和化合物形成.
主要成果:
- 与直接涂层相比,粘合强度增加了超过0.5N mm−1,接触电阻减少了0.5 mΩ cm2.
- /合金表现出优越的导电能力,粘合力和表面粗度.
- 在375°C的最佳化结果是NiSi化合物,1 mΩ cm−2的接触电阻和2.7 N mm−1的粘合力.
结论:
- /合金种子层有效地增强后侧电网线的粘附性,并降低n-TOPCon太阳能电池中的欧米接触电阻.
- 这种新的方法提供了一种可行的技术解决方案,用于降低n-TOPCon太阳能电池制造的成本和提高效率.
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