对热能存储的宏封装相变材料进行实验和数值研究
Busra Arslan1,2,3, Mustafa Ilbas1
1Department of Energy Systems Engineering, Faculty of Technology, Gazi University, Ankara 06570, Turkey.
Materials (Basel, Switzerland)
|June 27, 2024
概括
封装,一个相变材料,显著改善热能储存. 这种技术提高了传热和充电速度,克服了在热能存储单元中使用传统的局限性.
科学领域:
- 材料科学 材料科学 材料科学
- 热力工程是热力工程中的一个.
- 储能 储能 储能 储能 储能 储能
背景情况:
- 石相变材料 (PCM) 由于其优势,被广泛用于热能存储 (TES).
- 的关键局限性包括低导热性,狭窄的操作温度范围和泄漏问题.
- 宏封装是一种有前途的技术,可以解决这些局限性.
研究的目的:
- 设计和分析一个热能存储单元 (TESU),使用状的缩法.
- 为了调查封装对热能存储性能的影响.
- 为了评估传热流体 (HTF) 输入条件对充电性能的影响.
主要方法:
- 在带有管状换热器的TESU上进行了实验和数值分析.
- 在数值模拟中使用了Ansys 18.2-Fluent软件.
- 测试了两种类型的 (封装和非封装) 具有不同的热物理特性.
主要成果:
- 热传递速率受到HTF摄入温度的显著影响.
- 帕拉芬封装导致总化时间大幅减少.
- 能量储存增加了60.5%的帕拉芬-1和50.7%的帕拉芬-2与封装.
结论:
- 圆柱式宏封装有效地提高了的导热性和热传递.
- 封装可以提高TESU的充电率和总体储能能力.
- 这项研究展示了一种可行的方法来克服石的局限性,以改善热能存储应用.
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