对4H-SiC沟金属氧化物半导体场效应晶体管结构的无式诱导开关诱导的电参数退化和优化的全面分析
Li Liu1, Jingqi Guo2, Yiheng Shi2
1State Key Laboratory of Wide-Bandgap Semiconductor Devices and Integrated Technology, School of Microelectronics, Xidian University, Xi'an 710071, China.
Micromachines
|June 27, 2024
概括
这项研究研究了碳化 (SiC) MOSFETs的无感应切换 (UIS) 特性. 由于热载体注入,双槽 (DT-SiC) MOSFET显示出比不对称 (AT-SiC) 类型更多的门氧化物损伤.
科学领域:
- 材料科学 材料科学 材料科学
- 电气工程 电气工程
- 半导体物理 半导体物理
背景情况:
- 碳化物 (SiC) 金属氧化物半导体场效应晶体管 (MOSFET) 对于高功率应用至关重要.
- 了解它们在未紧感应切换 (UIS) 压力下的行为对于可靠性至关重要.
- 不对称 (AT) 和双沟 (DT) SiC MOSFET结构表现出不同的故障机制.
研究的目的:
- 综合研究1200V的AT-SiC和DT-SiC MOSFET的UIS特性.
- 在电热应力组合下分析电气降解.
- 提出一个改进的DT MOSFET设计,以提高门介电可靠性.
主要方法:
- 单个和重复的UIS事件的实验调查.
- TCAD (技术计算机辅助设计) 模拟用于分析雪崩期间的内部电热应力.
- 破产设备的解封,以确定故障位置.
主要成果:
- 由于热载体注入,DT-SiC MOSFET比AT-SiC MOSFET更容易受到氧化物损伤.
- 在重复的UIS压力下分析了参数退化,揭示了典型的电气故障特征.
- 模拟证实了在雪崩崩期间设备内的电热应力分布.
结论:
- AT和DT MOSFET之间的结构差异导致了不同的故障模式.
- 在UIS条件下,门介电可靠性是DT-SiC MOSFET在UIS条件下的一个关键问题.
- 建议采用一种具有P型屏蔽的新型级氧化物垂直功率DT MOSFET设计,以提高门介电可靠性.
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