3DN-

Jinhyoung Lee1,2, Gunhoo Woo3,4, Gyuyoung Lee1

  • 1School of Mechanical Engineering, Sungkyunkwan University (SKKU), Suwon-si, Gyeonggi-do 16419, Republic of Korea.

概括

研究人员开发了用于铜聚合物结合的新型N-异环碳素 (NHC) 纳米层,增强了3D异构集成. 这一突破改善了先进芯片架构的热稳定性和导电性.