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相关实验视频

Updated: Jun 21, 2025

Origami Inspired Self-assembly of Patterned and Reconfigurable Particles
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基于Au/Ni-W多层薄膜改性铜基结构的固相过渡接方法.

Jin Xiao1,2, Qian Zhai1, Jia Luo2

  • 1School of Mechanical and Electrical Engineering, Guangzhou Huali College, Guangzhou 511300, China.

Heliyon
|July 11, 2024
PubMed
概括

这项研究开发了一种新的室温接技术,在铜微结构上使用超声波辅助无接. Au/Ni-W 修改显著提高了关节的强度和可靠性,防止了电子元件的热损伤.

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科学领域:

  • 材料科学与工程 材料科学与工程
  • 表面科学是一门学科.
  • 纳米技术 纳米技术

背景情况:

  • 高点无料会在微妙的电子元件中造成残余应力和热损伤.
  • 现有的接方法在先进的微观结构上扎着可靠性问题.

研究的目的:

  • 为铜基微结构开发室温接方法.
  • 提高接电子元件的机械强度和可靠性.
  • 为了减轻接过程中的热损伤和残余应力.

主要方法:

  • 通过电化学沉积制造圆形的铜微结构.
  • 无形- (Ni-W) 合金和金 (Au) 纳米层的连续涂层.
  • 在室温下使用无 (SAC305) 的超声波辅助过渡接.
  • 使用扫描电子显微镜 (SEM) 和X射线光 (XRF) 的微结构分析.

主要成果:

  • 实现了瞬间接,平均剪切强度为43.06 MPa.
  • 经过Au/Ni-W修改的接口表现出最小的空隙和纯性断裂模式.
  • 该Ni-W层有效地抑制了过度的间扩散和金属间化合物 (IMC) 的生长.
关键词:
扩散扩散是一种扩散.电子包装 电子包装微观结构的微观结构接 接 接 接 接薄膜薄膜是一种薄膜.

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Last Updated: Jun 21, 2025

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结论:

  • Au/Ni-W多层修改使铜微结构能够在室温下可靠地接.
  • 这种技术可以防止热损伤和残余应力,确保元件的安全性和可靠性.
  • 开发的方法为先进的电子包装应用提供了有前途的解决方案.