通过表面火处理来增强异常谷物生长,以消除Cu-Cu结合接口,使用 (111) 导向的纳米结合铜

Tsan-Feng Lu1, Yu-Ting Yen1, Yuan-Fu Cheng1

  • 1Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan.

PubMed
概括

一种新的火处理允许在275°C的温度下直接将铜与铜结合在一起,从而实现先进的包装. 这种方法诱导了应变能量,使得在结合界面上成功的谷物生长.

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