通过表面火处理来增强异常谷物生长,以消除Cu-Cu结合接口,使用 (111) 导向的纳米结合铜
Tsan-Feng Lu1, Yu-Ting Yen1, Yuan-Fu Cheng1
1Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan.
Materials (Basel, Switzerland)
|July 13, 2024
概括
一种新的火处理允许在275°C的温度下直接将铜与铜结合在一起,从而实现先进的包装. 这种方法诱导了应变能量,使得在结合界面上成功的谷物生长.
科学领域:
- 材料科学 材料科学 材料科学
- 表面工程是什么?表面工程是什么?
- 纳米技术纳米技术
背景情况:
- 铜-铜 (Cu-Cu) 接头对于先进电子产品的超高密度包装至关重要.
- 目前的方法需要处理温度低于300°C,这对实现强大的结合构成了挑战.
研究的目的:
- 开发一种新的表面修饰技术,用于低温Cu-to-Cu直接粘合.
- 为了研究火处理对 (111) 导向纳米双胞胎对粘合应用的影响.
主要方法:
- 对以111为导向的纳米双胞胎Cu.应用一种新的火处理方法.
- 使用电子反散衍射 (EBSD) 进行晶体分析.
- 使用核心平均误导 (KAM) 分析来量化应变能量.
主要成果:
- 在275°C使用火处理实现了成功的Cu-to-Cu直接结合.
- 处理诱导了Cu薄膜中的应变能量,导致了纹的表面形态.
- 在低加工温度下,通过Cu-Cu结合接口确认了颗粒的生长.
结论:
- 火处理是低温Cu-to-Cu直接粘合的有效方法.
- 诱导的应变能量和由此产生的表面形态是成功结合的关键因素.
- 这种技术对于需要高密度互连的先进包装应用具有前景.
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