在Ag-Pd系统中,理论上理解与电迁移相关的表面扩散和电流诱导力的理论理解
Yumin Zhang1, Zijian Hong1, Zhizhen Ye1,2
1School of Materials Science and Engineering, Zhejiang University, Hangzhou 310027, P. R. China.
ACS omega
|July 15, 2024
概括
在Ag-Pd互连中,电迁移是由阶段边缘扩散驱动的. 的缺陷通过增加扩散障碍和减少驱动力来阻碍银原子迁移.
科学领域:
- 材料科学 材料科学 材料科学
- 凝聚物质物理学 凝聚物质物理学
- 计算材料科学科学 计算材料科学
背景情况:
- 电迁移是集成电路互连中的关键故障机制,由缩小的制造工艺加剧.
- 了解银合金 (Ag-Pd) 等材料中的原子扩散对于提高互连可靠性至关重要.
研究的目的:
- 使用ab initio计算,研究Ag-Pd合金系统中的原子扩散过程.
- 阐明主要的扩散机制和电流诱导的力量对原子迁移的影响.
主要方法:
- 使用ab initio计算方法来模拟原子扩散.
- 在Ag-Pd系统的 (111) 表面上分析阶段边缘扩散.
- 检查对移动的银 (Ag) 原子的电流诱导力的作用.
主要成果:
- 在 (111) 表面的阶梯边缘扩散被确定为主要的扩散机制.
- (Pd) 替代缺陷增加了扩散的能量障碍.
- Pd 缺陷减少了作用于 Ag 原子的电流诱导力的大小.
结论:
- 该研究提供了对Ag-Pd互连中的电迁移机制的基本见解.
- 的缺陷通过改变扩散动力学和驱动力来显著阻碍电迁移.
- 这些发现有助于开发更强大的互连材料,用于先进的集成电路.
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