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冷电解硬度铜的高温回火行为

Hanieh Solouki¹, Roohollah Jamaati¹, Hamed Jamshidi Aval¹

¹Department of Materials Engineering, Babol Noshirvani University of Technology, Shariati Ave., Babol, 47148-71167, Iran.

|July 19, 2024

概括

不对称的冷和后提高铜的强度和电导率. 这种方法提炼了颗粒结构,提高了机械性能,同时保持了电性能.

科学领域:

材料科学材料科学材料科学
金工业是金工业的一个方面.
机械工程机械工程

背景情况:

纯铜很容易变软,大多数强化方法会降低其电导率.
颗粒精炼是加强铜的首选方法,同时保持电导率.
塑料变形之后的火是有效的创建细粒度的金属.

研究的目的:

为了研究冷电解硬 (ETP) 铜板的高温回火行为.
评估不对称的冷和后对铜的微观结构,机械性能和电导性的影响.

主要方法:

电解耐磨铜板经历了90%的不对称冷.
随后,在673K的高温下进行了高温后化,持续时间从1到120分钟.
进行了微结构分析,机械测试 (硬度,抗拉强度),断裂表面检查和电导度测量.

主要成果:

再结晶发生在化后的1-2分钟内,导致显著的微观结构变化.
经过120分钟的制,由于Cu2O颗粒的固定,产生了细小的等粒 (∼9微米),与对称制相比,具有更均的微观结构.
退火1分钟后,产量和拉伸强度显著增加 (分别达到410.2MPa和418.6MPa),在10分钟后达到平原.
电导率从77.6%增加到97.5%IACS,化时间从1分钟增加到120分钟,受质感发展的影响 (立方体方向增强电子移动性).

结论:

不对称的冷与高温后结合,有效地提高了铜的强度.
这一过程还成功地保持了高电导率,并取得了显著的改进.
该方法为生产适用于苛刻应用的高性能铜材料提供了可行的途径.

关键词:

电导率电导率电导率电导率电解硬铜 (ETP) 是一种电解硬铜.在高温后回火后的高温回火.机械特性机械特性微观结构和质地和纹理.

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