Thermal expansion and Thermal stress: Problem Solving
Yield Criteria for Ductile Materials under Plane Stress
Thermal Stress
Bending of Members Made of Several Materials
您也可能阅读
通过共同作者、期刊和引用图与本文相关的文章。
Rongjie Yang1,2, Yandong Wang1, Zhenbang Zhang1
1Key Laboratory of Advanced Marine Materials, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, China. xuechen@nimte.ac.cn.
研究人员开发了先进的化 (BN) 热接口材料 (TIM),具有增强的导热率和低压缩模量,用于有效冷却电子设备. 这些新的BN-TIM超越了商业选择,改善了散热.
科学领域:
背景情况:
研究的目的:
主要方法:
主要成果:
结论: