互补的二维场效应晶体管的单体三维集成
Rahul Pendurthi1, Najam U Sakib2, Muhtasim Ul Karim Sadaf2
1Engineering Science and Mechanics, Penn State University, University Park, PA, USA. rqp5233@psu.edu.
Nature nanotechnology
|July 23, 2024
概括
本研究展示了使用WSe2场效应晶体管 (FET) 的单体3D集成,克服了先进的互补金属氧化物半导体电路的热预算限制.
科学领域:
- 材料科学 材料科学 材料科学
- 电气工程 电气工程
- 半导体物理 半导体物理
背景情况:
- 半导体行业正在向3D集成迈进,以克服扩展的限制.
- 目前的3D集成电路 (IC) 面临着面积上空和寄生电容方面的挑战.
- 单立体3D集成 (M3D) 是有希望的,但受到ICs的热预算的限制.
研究的目的:
- 为了证明互补的WSe2场效应晶体管 (FET) 的单体3D集成.
- 为了克服先进的3D集成电路的热处理限制.
- 为了实现2D材料在3D架构中的密集和规模集成.
主要方法:
- 在1级整合n型WSe2 FET,在2级整合p型WSe2 FET.
- 为了密集的相互连接,利用了300纳米径的子微米距离.
- 垂直集成逻辑门的制造 (逆变器,NAND,NOR).
主要成果:
- 实现了密集和缩放的M3D集成,距离小于1μm.
- 成功连接了两个层的300多个设备.
- 使用WSe2 FETs展示了功能性的垂直集成逻辑门.
结论:
- WSe2 FETs的单立体3D集成是可行的,可以克服热预算问题.
- 二维材料对于在补充性金属氧化物半导体电路中推进M3D至关重要.
- 这项工作为下一代3DIC铺平了道路.
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