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相关实验视频

Updated: Jun 19, 2025

Method for Simultaneous fMRI/EEG Data Collection during a Focused Attention Suggestion for Differential Thermal Sensation
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小尺寸的温度/高压集成传感器通过翻转芯片方法.

Mimi Huang1,2,3,4, Xiaoyu Wu4, Libo Zhao1,2,3,5,6

  • 1State Key Laboratory for Manufacturing Systems Engineering, International Joint Laboratory for Micro/Nano Manufacturing and Measurement Technologies, Xi'an Jiaotong University, Xi'an, 710049 China.

Microsystems & nanoengineering
|July 25, 2024
PubMed
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此摘要是机器生成的。

本研究介绍了一种新的,紧的集成传感器,用于液压系统中的高压和温度监测. 新设计提高了智能控制和故障预测在苛刻的应用程序的可靠性和效率.

科学领域:

  • 材料科学与工程 材料科学与工程
  • 传感器技术 传感器技术
  • 微电子机械系统 (MEMS) 是一种微电子机械系统.

背景情况:

  • 现代液压系统需要紧,可靠的传感器来预测故障和智能控制.
  • 现有的温度和压力传感器平面集成方法在压力范围,尺寸和可靠性方面存在局限性.
  • 需要先进的集成传感器,能够在苛刻的环境中高性能运行.

研究的目的:

  • 开发一个小尺寸,高压和温度集成的传感器,使用翻转芯片技术.
  • 通过垂直排列和 vias来提高传感器可靠性和信号传输效率.
  • 使用温度补偿来提高压力测量精度.

主要方法:

  • 采用了翻转芯片技术,用于压力和温度传感器单元的垂直集成.
  • 设计并模拟了一个有圆角角的方形隔膜,通过压力阻抗效应来进行高压传感.
  • 集成了一个薄膜金电阻器用于温度测量和补偿.
  • 使用MEMS技术制造了集成芯片,并将其打包到一个紧的传感器中.

主要成果:

  • 集成的压力传感器表现出7.97mV/MPa的灵敏度和低灵敏度漂移 (-0.19%FS) 在0-20MPa和-40-120°C之间.
  • 取得了优异的性能指标,包括线性 (0.16% FS),歇斯底里 (0.04% FS),可重复性 (0.06% FS) 和精度 (0.18% FS).
关键词:
工程 工程师 工程师 工程师传感器 传感器 传感器

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Last Updated: Jun 19, 2025

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  • 温度传感器显示测量误差<±1°C,温度电阻系数为3142.997 ppm/°C.

    • 结论:

    • 拟议的翻转芯片集成传感器在大小缩小和高压和温度监测的可靠性方面取得了重大进展.
    • 传感器的高精度和补偿能力使其适用于汽车,工业设备和石油钻探的关键应用.
    • 这项技术可以提高高端液压系统的故障诊断和安全监测.