对于射频微系统包装的垂直互连技术
Yongfang Hu1,2, Wei Sun2, Yipeng Sun1,2
1School of Electronic Science & Engineering, Southeast University, Nanjing 210096, China.
Materials (Basel, Switzerland)
|July 27, 2024
概括
这项研究为毫米波射频微系统开发了可靠的1.5级互连. 优化的球互连确保了未来无线通信设备的高性能和可靠性.
科学领域:
- 电气工程 电气工程
- 材料科学 材料科学 材料科学
- 微系统工程 微系统工程
背景情况:
- 无线通信的进步需要在毫米波频段运行的高性能微系统.
- 现有的互连技术在实现所需的射频性能,集成兼容性和可靠性方面面临挑战.
研究的目的:
- 为射频微系统开发和优化1.5级互连.
- 为了确保良好的射频性能,集成过程兼容性和毫米波应用的高可靠性.
主要方法:
- 使用高频结构模拟器 (HFSS) 进行1.5级互连的数值建模.
- 分析各种直径的球,包括Sn96.5Ag3Cu0.5 (SAC305) 和Sn63Pb37.5 (SAC305) 的分析.
- 对垂直互连的互连结构参数和集成过程参数的优化.
主要成果:
- 针对SAC305 (0.2毫米直径) 和Sn63Pb37 (0.3毫米直径) 球,确定了优化的结构参数.
- 玻璃和微基板之间的成功互连,以及和高温联合烧焦陶 (HTCC) 基板之间的成功互连.
- 制造的微基板互连样本显示出高可靠性.
结论:
- 开发的1.5级互连满足了毫米波无线通信微系统的需求.
- 优化接球互连和集成过程对于实现高射频性能和可靠性至关重要.
- 这项工作为先进的射频微系统集成提供了可靠的互连解决方案.
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