Jove
Visualize
联系我们
JoVE
x logofacebook logolinkedin logoyoutube logo
关于 JoVE
概览领导团队博客JoVE 帮助中心
作者
出版流程编辑委员会范围与政策同行评审常见问题投稿
图书馆员
用户评价订阅访问资源图书馆顾问委员会常见问题
研究
JoVE JournalMethods CollectionsJoVE Encyclopedia of Experiments存档
教育
JoVE CoreJoVE BusinessJoVE Science EducationJoVE Lab Manual教师资源中心教师网站
使用条款与条件
隐私政策
政策

相关概念视频

Transmission Line Design Considerations01:23

Transmission Line Design Considerations

131
Aluminum has become the material of choice for overhead transmission lines, surpassing copper due to its abundance and cost-effectiveness. The most prevalent type is the aluminum conductor, steel-reinforced (ACSR), which combines aluminum strands around a steel core. Other variants include all-aluminum conductors (AAC), all-aluminum alloy conductors (AAAC), aluminum conductor alloy-reinforced (ACAR), and aluminum-clad steel conductors. Advanced designs, such as aluminum conductors with steel...
131
LC Circuits01:21

LC Circuits

2.4K
An LC circuit consists of an inductor and a capacitor, either in series or parallel. Consider a charged capacitor connected with an inductor in series. Before the switch is closed, all the energy of the circuit is stored in the electric field of the capacitor. When the switch is closed, the capacitor begins to discharge, producing a current in the circuit. The current, in turn, creates a magnetic field in the inductor. Because of the induced emf in the inductor, the current cannot change...
2.4K
Mesh Analysis for AC Circuits01:12

Mesh Analysis for AC Circuits

363
In the domain of radio communication, the significance of impedance matching must be considered. It is crucial to ensure the efficient transmission of signals between radio transmitters and receivers. Achieving this balance involves using impedance-matching circuits, with one fundamental configuration comprising a resistor, capacitor, and inductor.
The process of harmonizing these impedances begins with a clear understanding of the input and output signals. Once these signals are known, the...
363
Metal-Semiconductor Junctions01:24

Metal-Semiconductor Junctions

324
The contact of metal and semiconductor can lead to the formation of a junction with either Schottky or Ohmic behavior.
Schottky Barriers
Schottky barriers arise when a metal with a work function (Φm) contacts a semiconductor with a different work function (Φs). Initially, electrons transfer until the Fermi levels of the metal and semiconductor align at equilibrium. For instance, if Φm > Φs, the semiconductor Fermi level is higher than the metal's before contact. The...
324
Semiconductors01:22

Semiconductors

674
There is variation in the electrical conductivity of materials - metals, semiconductors, and insulators that are showcased with the help of the energy band diagrams.
Metals such as copper (Cu), zinc (Zn), or lead (Pb) have low resistivity and feature conduction bands that are either not fully occupied or overlap with the valence band, making a bandgap non-existent. This allows electrons in the highest energy levels of the valence band to easily transition to the conduction band upon gaining...
674

您也可能阅读

相关文章

通过共同作者、期刊和引用图与本文相关的文章。

排序
Same author

Enhanced sensitivity in nonlinear parity-time symmetric silicon micromechanical resonators.

Microsystems & nanoengineering·2025
Same author

Nonlinear distortion of nonreciprocal transmission in parity-time-symmetric silicon micromechanical resonators.

Microsystems & nanoengineering·2025
Same author

Putting piezoelectric sensors into Fano resonances.

Microsystems & nanoengineering·2024
Same author

Inductor-capacitor passive wireless sensors using nonlinear parity-time symmetric configurations.

Nature communications·2024
Same author

Passive Wireless Partial Discharge Sensors with Multiple Resonances.

Micromachines·2024
Same author

Exceptional points enhance sensing in silicon micromechanical resonators.

Microsystems & nanoengineering·2024
Same journal

Correction: Yang et al. Microstructural Characteristics of High-Pressure Die Casting with High Strength-Ductility Synergy Properties: A Review. <i>Materials</i> 2023, <i>16</i>, 1954.

Materials (Basel, Switzerland)·2026
Same journal

Effect of La and Ce Microalloying on the Corrosion Resistance of 0.4Sb Low-Alloy Steel in a Harsh Marine Atmospheric Environment.

Materials (Basel, Switzerland)·2026
Same journal

High-Temperature Properties of Magnesium Ammonium Phosphate Cement Modified with Gold Tailings.

Materials (Basel, Switzerland)·2026
Same journal

A Study on the Evolution of Intermetallic Phase Microstructure and High-Temperature Creep Behavior in Mg-8.0Al-1.0Nd-1.5Gd-Mn Alloys.

Materials (Basel, Switzerland)·2026
Same journal

Material-Driven Clinical Complications in Mechanical Circulatory Support: From Blood-Material Interactions to Device-Related Adverse Events.

Materials (Basel, Switzerland)·2026
Same journal

Influence of Final Irrigation on Calcium Silicate-Based Sealer Dentinal Tubular Penetration: A Systematic Review.

Materials (Basel, Switzerland)·2026
查看所有相关文章

相关实验视频

Updated: Jun 18, 2025

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods
07:51

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods

Published on: December 23, 2013

7.4K

对于射频微系统包装的垂直互连技术

Yongfang Hu1,2, Wei Sun2, Yipeng Sun1,2

  • 1School of Electronic Science & Engineering, Southeast University, Nanjing 210096, China.

Materials (Basel, Switzerland)
|July 27, 2024
PubMed
概括
此摘要是机器生成的。

这项研究为毫米波射频微系统开发了可靠的1.5级互连. 优化的球互连确保了未来无线通信设备的高性能和可靠性.

关键词:
无线电射频微系统是一个RF微系统.系统在包装中的系统.垂直相互连接的垂直相互连接

更多相关视频

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
08:21

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

Published on: March 20, 2015

12.4K
Fabrication of Low Temperature Carbon Nanotube Vertical Interconnects Compatible with Semiconductor Technology
09:20

Fabrication of Low Temperature Carbon Nanotube Vertical Interconnects Compatible with Semiconductor Technology

Published on: December 7, 2015

7.7K

相关实验视频

Last Updated: Jun 18, 2025

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods
07:51

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods

Published on: December 23, 2013

7.4K
Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
08:21

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

Published on: March 20, 2015

12.4K
Fabrication of Low Temperature Carbon Nanotube Vertical Interconnects Compatible with Semiconductor Technology
09:20

Fabrication of Low Temperature Carbon Nanotube Vertical Interconnects Compatible with Semiconductor Technology

Published on: December 7, 2015

7.7K

科学领域:

  • 电气工程 电气工程
  • 材料科学 材料科学 材料科学
  • 微系统工程 微系统工程

背景情况:

  • 无线通信的进步需要在毫米波频段运行的高性能微系统.
  • 现有的互连技术在实现所需的射频性能,集成兼容性和可靠性方面面临挑战.

研究的目的:

  • 为射频微系统开发和优化1.5级互连.
  • 为了确保良好的射频性能,集成过程兼容性和毫米波应用的高可靠性.

主要方法:

  • 使用高频结构模拟器 (HFSS) 进行1.5级互连的数值建模.
  • 分析各种直径的球,包括Sn96.5Ag3Cu0.5 (SAC305) 和Sn63Pb37.5 (SAC305) 的分析.
  • 对垂直互连的互连结构参数和集成过程参数的优化.

主要成果:

  • 针对SAC305 (0.2毫米直径) 和Sn63Pb37 (0.3毫米直径) 球,确定了优化的结构参数.
  • 玻璃和微基板之间的成功互连,以及和高温联合烧焦陶 (HTCC) 基板之间的成功互连.
  • 制造的微基板互连样本显示出高可靠性.

结论:

  • 开发的1.5级互连满足了毫米波无线通信微系统的需求.
  • 优化接球互连和集成过程对于实现高射频性能和可靠性至关重要.
  • 这项工作为先进的射频微系统集成提供了可靠的互连解决方案.