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Pd层厚度对Pd涂层Cu线的粘合可靠性的影响

Junling Fan¹, Donglin Yuan¹, Juan Du¹

¹School of Chemical and Environmental Engineering, Jiaozuo University, Jiaozuo 454000, China.

|July 27, 2024

概括

铜 (Cu) 线上较厚的 (Pd) 层提高了粘合可靠性. 增加Pd厚度提高了高温储存后的粘合强度,并降低了热循环中的故障率,表明了优越的环境抗性和稳定性.

科学领域:

材料科学材料科学材料科学
表面工程是什么?表面工程是什么?
可靠性工程可靠性工程

背景情况:

在电子包装中,粘合可靠性至关重要.
涂铜 (PCC) 线用于各种电子互连.
了解Pd层厚度对键完整性的影响至关重要.

研究的目的:

为了研究 (Pd) 层厚度对Pd涂层Cu (PCC) 线束的可靠性的影响.
在高温储存之前和之后评估结合性能.
为了确定最佳的Pd层厚度,以提高结合稳定性.

主要方法:

使用具有不同Pd层厚度的PCC线材制造粘合样本.
评估结合参数 (压力,超声波功率) 对结合形成的影响.
结合样品的高温储存和冷热循环测试.
对键强度,故障模式和金属间化合物 (IMC) 增长的分析.

主要成果:

粘合参数显著影响粘合质量;低于最佳的设置导致不充分的变形或损伤.
高温储存促进了Cu-Ag金属间化合物 (IMC) 的生长,最初增加了键强度.
较厚的Pd层在高温储存后表现出更高的结合强度,在热循环中故障率更低.
在较薄的Pd层中,IMC过度增长会导致Kirkendall毛孔和随着时间的推移而降低的剪切力.

结论:

在PCC电线上,Pd层的厚度是结合可靠性的关键因素.
较厚的Pd层提供了对环境压力,如高温和热循环的优越抵抗力.
优化Pd层厚度可以提高电子互连的长期稳定性和整体可靠性.

关键词:

有Pd涂层的Cu电线.Pd-层的厚度层的厚度可靠性的可靠性

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