一个新的4H-SiC SGT MOSFET,具有改进的P+屏蔽区域和集成的Scottky屏障二极管
Xiaobo Cao1, Jing Liu2, Yingnan An2
1Department of Electrical Engineering, Xi'an University of Technology, Xi'an 710048, China.
Micromachines
|July 27, 2024
概括
这项研究介绍了SPDT-MOS,一种新的碳化MOSFET. 它通过优化电场和电流路径,显著提高设备性能,提高可靠性和效率.
科学领域:
- 材料科学 材料科学 材料科学
- 电气工程 电气工程
- 半导体设备 半导体设备
背景情况:
- 碳化 (SiC) MOSFET对于高功率应用至关重要.
- 现有的设计面临着前进性能和可靠性方面的挑战.
- 源沟结构可以限制设备的效率.
研究的目的:
- 提出和分析一个新的SiC SGT MOSFET,即SPDT-MOS.
- 通过用改进的P+屏蔽区域 (PSR) 取代源沟来提高前进性能.
- 为了研究传导特性,门氧化物可靠性和频率响应的改进.
主要方法:
- 设计和模拟SPDT-MOS架构.
- 使用屏蔽的P+屏蔽区域 (PSR) 和接地分隔门 (SG).
- 整合一个侧墙Schottky屏障二极管 (SBD) 来管理体二极管激活.
主要成果:
- 与DTMOS相比,SPDT-MOS显示出显著降低的门排水容量,门电荷和反向恢复电荷.
- 与DS-MOS相比,启动电阻降低了20%,故障电压增加了8.1%.
- 实现了更好的电场分布和扩大电流传导路径.
结论:
- 拟议的SPDT-MOS比现有的SiC MOSFET提供了优越的性能指标.
- 改进的PSR和集成的SBD有助于提高设备效率和可靠性.
- 这种设计代表了SiC电源设备技术的重大进步.
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