SLA 3D

Harrison Khoo1, William Shaen Allen2, Netzahualcóyotl Arroyo-Currás3,4

  • 1Department of Mechanical Engineering, Johns Hopkins University, 3400 N Charles ST., Latrobe 105, Baltimore, MD, 21218, USA.

Scientific reports
|July 31, 2024
PubMed
概括

这项研究引入了微流体设备的快速,经济高效的3D打印方法,使热塑性芯片实验室测试能够更快地开发和大规模生产,用于分散式诊断.

相关概念视频