2D FETs从LAB到FAB的过渡:可用的策略和未来的趋势
Yury Illarionov1, Yezhu Lv1, Yehao Wu1
1Laboratory of 2D Optoelectronics and Nanoelectronics (L2DON), Department of Materials Science and Engineering, Southern University of Science and Technology, 1088 Xueyuan Blvd, Shenzhen 518055, China.
Nanomaterials (Basel, Switzerland)
|August 9, 2024
概括
关于二维场效应晶体管 (FET) 的研究已经取得了重大进展. 工业界专注于与传统绝缘体相结合的过渡金属二甲基化物 (TMD),面临接口挑战,而实验室研究则探索用于改进二维FET的原生氧化物.
科学领域:
- 材料科学 材料科学 材料科学
- 电气工程 电气工程
- 纳米技术 纳米技术
背景情况:
- 在过去的十年中,二维通道场效应晶体管 (FET) 取得了重大进展.
- 目前正在进行大规模生产和2D FET垂直堆叠的工业试验.
- 目前行业的重点是使用传统3D氧化物绝缘体的过渡金属二甲基化物 (TMD) 通道.
研究的目的:
- 讨论2D FETs工业集成的挑战.
- 突出2D FETs的替代实验室研究路线.
- 建议2D FET技术的市场应用的未来步骤.
主要方法:
- 在过去十年中,对二维FET的研究进展进行了回顾.
- 对行业标准材料 (TMD) 和绝缘体 (Al2O3,HfO2) 的分析.
- 实验室发现的探索,包括使用原生氧化物的2D FinFET.
主要成果:
- 工业界采用3D氧化物TMD导致接口质量和可靠性问题.
- 使用原生氧化物的实验室研究已经产生了有希望的结果,包括第一个2D FinFET.
- 替代方法为当前的整合挑战提供了潜在的解决方案.
结论:
- 在工业中依赖传统的3D氧化物绝缘体阻碍了2D FET的性能和可靠性.
- 实验室研究,特别是使用本地氧化物,为下一代二维FET提供了可行的替代方案.
- 进一步研究和采用这些替代路线对于2D FET技术的市场成功至关重要.
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