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导热聚合物复合材料:最近的进展和应用

Jianfeng Tan1, Yuan Zhang1

  • 1College of Intelligent Systems Science and Engineering, Hubei Minzu University, Enshi 445000, China.

Molecules (Basel, Switzerland)
|August 10, 2024
PubMed
概括

高性能导热聚合物复合材料 (TCPCs) 为电子产品过热提供了解决方案. 本综述详细介绍了用于先进应用的提高其导热率的方法.

科学领域:

  • 材料科学 材料科学 材料科学
  • 聚合物科学 聚合物科学
  • 纳米技术 纳米技术

背景情况:

  • 微电子微型化需要先进的热管理材料.
  • 导热聚合物复合材料 (TCPC) 具有低密度和易于加工等优势.
  • 目前的TCPC面临着低于预期的导热率的挑战,限制了高性能应用.

研究的目的:

  • 综合审查导热聚合物复合材料 (TCPC) 的进展情况.
  • 详细介绍TCPC中的导热机制和影响因素.
  • 为了分类和总结提高TCPC热性能的方法.

主要方法:

  • 对聚合物复合材料中的导热机制现有文献的审查.
  • 影响热性能的因素分析:聚合物特性,界面电阻,填充物特性.
  • 对TCPC的热导电性增强策略的分类和摘要.

主要成果:

  • 确定了控制TCPC热导电性的关键机制.
  • 讨论了聚合物矩阵,填充剂和界面电阻对热性能的影响.
  • 总结了改善聚合物复合材料的导热性的各种技术.

结论:

关键词:
一个先进的应用程序应用程序.聚合物纳米复合材料 聚合物纳米复合材料导热导热的导热器

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  • 尽管目前的局限性,TCPC显示出热管理的巨大潜力.
  • 需要进一步的研究来克服挑战并优化TCPC的性能.
  • 未来的方向包括灵活电子,个人热管理和航空航天领域的应用.