多离子液体:热接口材料的一个有前途的矩阵
Jianhui Zeng1,2, Ting Liang3, Baohao Yang1
1State Key Laboratory of Materials for Integrated Circuits, Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China.
ACS applied materials & interfaces
|August 20, 2024
概括
聚离子液体 (PIL) 为高性能热接口材料 (TIM) 提供了一种新的解决方案,克服了的局限性. 这些先进的TIM提供了卓越的粘附性,灵活性和自我修复性,以在AI应用中提供可靠的芯片包装.
科学领域:
- 材料科学 材料科学 材料科学
- 聚合物化学 聚合物化学
- 纳米技术纳米技术
背景情况:
- 由人工智能驱动的高密度碎片包装的进步需要改进的热管理解决方案.
- 目前基于的热接口材料 (TIM) 在耐热性,粘附性和机械灵活性方面存在局限性,这阻碍了要求高的应用中的可靠性.
研究的目的:
- 引入多离子液体 (PILs) 作为高性能TIM的新型矩阵.
- 评估基于PIL的TIM的特性,以提高芯片规模包装中的热管理.
主要方法:
- 聚离子液体 (PILs) 的合成和表征作为TIM矩阵.
- 通过与液体金属混合来制订基于PIL的TIM.
- 在封装结构中基于PIL的TIM的性能评估,包括附着性,灵活性和导热性测试.
主要成果:
- PIL 具有较低的弹性模量 (60 kPa),特殊的伸展性 (>3800%) 和高粘合力 (高达 4.10 MPa).
- 基于PIL的TIM显示出出色的自我修复性,可回收性和填充剂兼容性.
- 开发的基于PIL的TIM在包装测试中显示了高破裂延伸 (>350%),持续粘附 (1.70MPa) 和良好的导热性.
结论:
- 聚离子液体为先进的TIM提供了一个有希望的替代矩阵,超越了传统系统的性能限制.
- 基于PIL的TIM提供了显著的性能优势,包括为下一代电子设备增强的可靠性和热管理.
- 这项研究为PIL在热管理中的更广泛应用和下一代TIM的开发铺平了道路.
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