在GeTe基合金中进行晶格软化和带融合,以实现高热电性能
Song Yi Back1,2, Hyunyong Cho1,3, Wenhao Zhang2
1Department of Applied Physics and Institute of Natural Sciences, Kyung Hee University, Yong-in 17104, South Korea.
ACS applied materials & interfaces
|August 26, 2024
概括
这项研究通过优化反 (Sb) 兴奋剂来提高无GeTe合金的热电性能. 化Sb诱导了晶格软化和频段融合,达到1.70的峰值热电功率 (zT).
科学领域:
- 材料科学 材料科学 材料科学
- 固态物理 固态物理
- 热电学是一种热电学.
背景情况:
- 基于GeTe的合金是中温应用的有希望的无热电材料.
- 在GeTe中 (I) 兴奋剂通过增加格子无和性和降低相位过渡温度来提高热电性能.
- 由于环境问题,人们正在寻找无替代PbTe的替代品.
研究的目的:
- 调查反 (Sb) 和 (I) 兴奋剂对GeTe合金热电性能的协同效应.
- 阐明增强热电性能背后的机制,重点关注带融合和格子软化.
- 优化Sb兴奋剂度,以改善热电功率 (zT).
主要方法:
- 合成和表征Ge1-ySbyTe0.9I0.1合金的不同度的Sb (y = 0.10, 0.12, 0.14, 0.16). 这些合金的度是不同的.
- 进行X射线衍射 (XRD) 分析,以评估格子结构和内部应变.
- 热电特性测量 (Seebeck系数,电导率,热导率) 和电子带结构计算 (双带建模).
主要成果:
- 在GeTe0.9I0.1中使用Sb染会导致晶格变软,并降低晶格导热率.
- Sb兴奋剂促进了价值带的融合,增加了山谷退化,并增强了状态的电子密度.
- 在Ge1-ySbyTe0.9I0.1中优化Sb兴奋剂 (y=0.12) 在723 K.达到1.70的热电功率 (zT) 峰值.
结论:
- 在Sb诱导的晶格软化和带融合之间的协同作用显著提高了基于GeTe的合金的热电性能.
- Sb合有效地优化载体度和电子带结构,以提高热电效率.
- Ge1-ySbyTe0.9I0.1合金是一种高性能,无的热电材料,用于中温应用.
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