相关实验视频
Updated: Jun 14, 2025

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Scanning-probe Single-electron Capacitance Spectroscopy
Published on: July 30, 2013
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一个CMOS兼容的过程,用于6英寸蓝宝石上的≥3kV的GaN电源HEMT,使用In Situ SiN作为门介电
Jie Zhang1, Xiangdong Li1,2, Jian Ji1
1Guangzhou Wide Bandgap Semiconductor Innovation Center, Guangzhou Institute of Technology, Xidian University, Guangzhou 510555, China.
Micromachines
|August 29, 2024
概括
这项研究在蓝宝石基板上展示了高性能化高电子移动性晶体管 (GaN HEMT). 这些设备显示出出色的均性和高断电压,为先进的功率电子铺平了道路.
科学领域:
- 材料科学 材料科学 材料科学
- 半导体物理 半导体物理
- 电力电子 电力电子 电力电子
背景情况:
- 化高电子移动性晶体管 (GaN HEMT) 在基板上面临高压应用中的局限性,原因是复杂的缓冲层和晶圆曲折.
- 在替代基板上开发强大的GaN HEMT对于推进动力电子技术至关重要.
研究的目的:
- 在6英寸的蓝宝石基板上制造高性能GaN功率HEMT,使用CMOS兼容的工艺.
- 为了实现可靠的高压应用,在大型晶圆上实现统一的设备特性.
主要方法:
- 在6英寸的蓝宝石基板上制造GaN功率HEMT.
- 采用了1.5微米薄的GaN缓冲层和一个20nm在位SiN门介电器.
- 使用CMOS兼容的制造工艺.
主要成果:
- 在整个6英寸晶圆上实现了统一的门电压 (VTH) 和启动电阻 (R_ON).
- 经过证明的设备L_GD为30微米,W_G为36毫米.
- 显示了18.06 Ω·mm的R_ON和超出状态的故障电压超过3kV.
结论:
- 在6英寸的蓝宝石基板上成功制造了统一和高性能的GaN功率HEMT.
- 结果突出了这些设备在中压电力电子应用中的潜力.
- 证明的统一性对于大规模制造和部署具有重要意义.
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