在SOI FinFET设备中,总电离剂量和热载体注射引起的降解
Hao Yu1, Wei Zhou1, Hongxia Liu1
1Key Laboratory for Wide Band Gap Semiconductor Materials and Devices of Education Ministry, School of Microelectronics, Xidian University, Xi'an 710071, China.
Micromachines
|August 29, 2024
概括
这项研究研究了在绝缘体 (SOI) FinFETs在恶劣的航空航天环境中的可靠性. 模拟了总电离剂量 (TID) 和热载体注射 (HCI) 效应,显示它们可以部分抵消对方.
科学领域:
- 半导体设备物理学的物理
- 航空航天电子的可靠性
背景情况:
- 航空航天领域的电子设备面临恶劣的操作条件.
- 确保在绝缘体 (SOI) FinFET 的可靠性对于航空航天应用至关重要.
研究的目的:
- 调查SOI FinFETs的总电离剂量 (TID) 和热载体注射 (HCI) 可靠性.
- 模拟TID和HCI对设备性能的单独和合的影响.
主要方法:
- 使用模拟来评估TID对SOI FinFETs的影响.
- 进行了模拟,以评估HCI对SOI FinFET的影响.
- 模拟了TID和HCI的合效应.
主要成果:
- TID降低值电压,增加非状态电流和下值波动,并减少和排水电流,在高温下效应加剧.
- HCI增加了值电压,降低了和排水电流,在高温下更严重的影响.
- 对合TID和HCI效应的模拟显示了相互取消,根据合模式,电气参数的降解有所不同.
结论:
- TID和HCI对SOI FinFET的电气特性有着不同的,有时是相反的影响.
- TID和HCI的综合影响是复杂的,取决于特定的操作条件和合模式.
- 了解这些可靠性方面对于在苛刻的航空航天环境中部署SOI FinFET至关重要.
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