超薄小概要包 具有多引线的高速芯片的关键技术
Lijun Zhang1,2,3, Wenqiang Dang2,3, Yongshun Wang1,3
1School of Electronic and Information Engineering, Lanzhou Jiaotong University, Lanzhou 730070, China.
Micromachines
|August 29, 2024
概括
新的超薄小轮包 (TSOP) 技术可以实现高速芯片包装. 这些进步为各种应用提供了高可用性,低成本和更高的可靠性.
科学领域:
- 材料科学 材料科学 材料科学
- 电气工程 电气工程
- 半导体制造业 半导体制造业
背景情况:
- 开发先进的包装解决方案对于高速半导体设备至关重要.
- 现有的超薄小轮包 (TSOP) 技术面临大尺寸,高速芯片的局限性.
- 需要改进精确定位,框架设计和装配过程的技术.
研究的目的:
- 为大型高速芯片设计和开发超薄小轮包 (TSOP) 的关键技术.
- 解决芯片包装的技术挑战,包括减少厚度和密封.
- 提高先进的半导体组件的性能和可制造性.
主要方法:
- 开发了一种25微米精确定位子附着技术.
- 实现一个没有基岛的框架单元结构.
- 在框架内引入一个领先的共同平面布局.
- 优化TSO包轮,框架单元排列和框架分布.
主要成果:
- 成功解决了减少厚度,切割晶片,芯片粘合和塑料密封的技术问题.
- 设计的大型TSOP产品具有高可用性和可靠性.
- 实现了开发的包装技术的低成本和短生产周期.
结论:
- 开发的TSOP技术有效地解决了包装大尺寸,高速芯片的挑战.
- 新的包装解决方案在成本,可靠性和生产效率方面提供了显著的优势.
- 这种先进的包装技术适用于智能电子设备的广泛应用.
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