聚合物异质混合集成的马赫-泽恩德干扰仪 光学波导温度传感器
Zhanyu Gao1, Yuhang Du1, Qizheng Zhang1
1College of Integrated Circuits and Optoelectronic Chips, Shenzhen Technology University, Shenzhen 518118, China.
Polymers
|August 29, 2024
概括
这项研究引入了一种新的聚合物-异质集成马赫-泽恩德干扰仪 (MZI),用于增强温度传感. 与全聚合物传感器相比,混合设计显著提高了灵敏度.
科学领域:
- 光子学和光学工程的工程.
- 材料科学 材料科学 材料科学
- 集成光学 集成光学 集成光学
背景情况:
- 传统的温度传感器往往缺乏高级应用所需的灵敏度和集成能力.
- 马赫-泽恩德干扰仪 (MZIs) 是敏感的光学设备,但它们的性能可能受到材料特性的限制.
研究的目的:
- 提出和分析一种新的聚合物-异质集成马赫-泽恩德干扰仪 (MZI),用于增强温度传感.
- 调查混合集成对温度传感特征的影响.
- 为了比较不同的合方法和聚合物材料,以获得最佳的设备性能.
主要方法:
- 混合MZI结构的制造,结合聚合物和化的波导臂.
- 利用聚合物和的相反的热光学系数来提高温度灵敏度.
- 实施和模拟直接和侧合方法,以尽量减少光学损失.
- 评估使用PMMA,NOA和SU-8聚合物材料的设备的性能.
主要成果:
- 混合集成的MZI结构显示了显著增强的温度传感特性.
- 与直接合相比,侧合方法显示了较低的合损失 (0.1040.618 dB) 和更大的制造公差.
- 获得的灵敏度值为 -6.85 nm/K (PMMA), -6.48 nm/K (NOA) 和 -2.30 nm/K (SU-8),比全聚合物传感器高出一个数量级.
- 计算的温度响应度 (RT) 的值范围从13.16 × 10-5 K到32.20 × 10-5 K.
结论:
- 聚合物-杂集成的MZI提供了卓越的温度传感性能.
- 高热光系数聚合物与混合集成相结合,对芯片上温度传感有很大的希望.
- 侧合方法有利于减少损耗和提高可制造性.
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