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在热接口材料中构建牛状框架,以增强通过平面导热的热导电性

Zhi-Guo Wang¹, Yaonan Huo², Hai-Feng Nan³

¹School of Aeronautics and Astronautics, Sichuan University, Chengdu 610065, China.

ACS applied materials & interfaces

|August 29, 2024

概括

研究人员开发了一种以牛为灵感的热接口材料 (TIM),可将导热率提高一倍. 这种新的TIM显著改善了电子产品的散热,防止过热.

科学领域:

材料科学材料科学材料科学
纳米技术纳米技术
热力工程是热力工程中的一个.

背景情况:

高功率密度电子产品需要有效的散热,以防止过热.
热接口材料 (TIM) 对于管理热量至关重要,但提高它们的透平面导热率 (TC) 仍然是一个挑战.

研究的目的:

开发一款具有增强透平面TC的新型TIM,以改善散热.
为了创建一个类似牛的框架,以促进垂直热传导.

主要方法:

使用双微杆辅助曲方法,创建螺旋绕的化纳米板 (BNNS) /阿拉米德纳米纤维 (ANF) 层层.
该方法将相互连接的BNNS在TIM框架内垂直对齐.
福格尔的非线性模型被用来分析界面热阻.

主要成果:

与随机分布的BNNS对应物相比,牛形的TIM在通过平面的TC中实现了大约100%的增强.
新的框架将界面热阻降低了四个数量级.
该TIM显示出优异的散热,将LED芯片温度降低了42.6°C.

结论:

开发的类似牛的BNNS框架显著提高了TIM的垂直热传导.
这种方法提供了一个有前途的策略,用于制造高性能TIM,以确保可靠的电子设备操作.
该研究为改善高功率电子产品的热管理提供了一种有价值的方法.

关键词:

化的纳米片是化的.一个牛状的框架.导热性导热性导热性导热性导热性热接口材料热接口材料垂直排列方式垂直排列方式

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