大规模的5nm以下垂直晶体管由范德瓦尔斯集成
Xiaokun Yang1, Rui He1,2, Zheyi Lu1
1Key Laboratory for Micro-Nano Optoelectronic Devices of Ministry of Education, School of Physics and Electronics, Hunan University, Changsha, China.
Nature communications
|September 3, 2024
概括
一种新的层次传输工艺使得使用氧化 (IGZO) 可扩展制造超短通道垂直场效应晶体管 (VFET). 这种方法显著提高了设备的性能,并为先进的超薄垂直电子提供了途径.
科学领域:
- 材料科学 材料科学 材料科学
- 纳米技术纳米技术
- 半导体设备物理 半导体设备物理
背景情况:
- 垂直场效应晶体管 (VFET) 为短通道设备提供了潜力,但可扩展的制造仍然是一个挑战.
- 实现超短通道长度对于下一代电子产品至关重要.
- 氧化 (IGZO) 是薄膜晶体管的一个有前途的材料.
研究的目的:
- 为超短通道VFET开发一种可扩展的制造方法.
- 提高VFET的性能和开关比率.
- 为了证明大型氧化物半导体阵列的可转移性.
主要方法:
- 对于氧化 (IGZO) 半导体阵列和金属电极的层次传输过程.
- 在金属电极之间预先沉积的氧化物半导体的物理释放和分层.
- 制造2英寸尺度的VFET,可控制超短通道长度.
主要成果:
- 实现VFET的通道长度降至4nm.
- 取得的当前电流超过800 A/cm2.
- 显示了开关比率的显著增加,高达2 × 105,比对照样本高出两倍.
结论:
- 开发的分层工艺可以同时优化VFET的性能和可扩展性.
- 这种方法保留了超级垂直通道的内在特性.
- 该技术为超薄垂直设备转移大规模氧化物阵列提供了一种可行的方法.
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